Our SATA connector series is designed for stable data transmission and high reliability. With customizable pin count, pitch, materials, and plating specifications, we offer tailored solutions for diverse applications. Produced in our automated facilities with strict quality control, these connectors ensure excellent durability, heat resistance, and hot-swap performance. Widely used in computers, servers, and industrial storage devices, they deliver precision connection and long-lasting performance.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the best offer and detailed quotation!
This Micro-Fit 3.0 2×3 pin header connector is designed for high-current, high-density PCB power and signal transmission.
Using copper-alloy terminals with heavy tin over nickel plating, it supports up to 12.5 A per circuit at 250 V AC/DC, making it ideal for compact power boards and control modules. The vertical through-hole structure with locking peg/post gives strong mechanical retention on the PCB, reducing stress on solder joints under vibration or cable pull.
The connector housing is molded from UL94 V-0 flame-retardant LCP, offering excellent heat resistance for wave-soldering and reflow processes. Low contact resistance and high insulation resistance ensure stable electrical performance and low power loss over a long service life. This header can be perfectly matched with Micro-Fit 3.0 female connectors or customized wire harness assemblies.
| Product type | Micro-Fit 3.0 dual-row pin header connector |
| Pitch | 3.0 mm (Micro-Fit 3.0 series) |
| Positions | 2×3 pins (6 pins total) |
| Mounting style | Vertical / straight, through-hole PCB |
| Tail length | Approx. 2.1 mm pin protrusion |
| Locking feature | With plastic peg/post for secure PCB retention |
| Rated current | Up to 12.5 A max (AWG16 per pin) |
| Rated voltage | 250 V AC / DC |
| Contact resistance | ≤ 20 mΩ max |
| Insulation resistance | ≥ 1000 MΩ min |
| Dielectric strength | 1500 V AC / minute |
| Operating temperature | −40 °C to +105 °C |
| Salt-spray performance | 24 h, tin plated |
| Plating – square pin | Ni 50 μ" min under-plating, Sn 100 μ" min on mating area |
| Plating – fork / metal yoke | C2680 copper alloy, Ni 50 μ" min, Sn 100 μ" min |
| Terminal material | Copper alloy C1100 / C2680 |
| Housing material | LCP E130I, black, UL94 V-0, halogen-free |
| Environmental | HF, RoHS-compliant |
| Series compatibility | Micro-Fit 3.0 headers & female plug housings |
| Customization | Pin count, plating thickness, peg type, color and packed wire harness available |
⚙️ Applications
- PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including low-voltage signals, data transmission, and control interfaces.
- Consumer Electronics: Common in smart home appliances, printers, cameras, displays, controllers, and handheld devices for internal signal routing.
- Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters, robotics modules, and automation I/O interfaces.
- Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication boards, and signal expansion connectors.
- Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards, infotainment systems, and on-board control interfaces.
- Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network communication cards.
- IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules, sensor nodes, and embedded system expansion ports.
- Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and low-power control circuits.
- Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.
⚠️ Notes
- Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid mis-insertion, bent pins, or PCB pad damage.
- Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent overheating or contact failure.
- Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent deformation, cracked solder joints, or pin damage.
- Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or contaminants that reduce conductivity.
- Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to plastic materials such as LCP, PA6T, PA66, or PBT.
- Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or mechanical instability.
- Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for SMT pin headers.
- Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal oxidation; use anti-static packaging if required.
- Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to avoid mating failure.
- Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your application’s durability, corrosion resistance, and signal reliability needs.
